Queclink Listed on ChiNext Board of Shenzhen Stock Exchange
On January 11, 2017, Queclink Wireless Solutions Co., Ltd. (300590.SZ) raised a total of RMB570 million in its IPO on ChiNext board of Shenzhen Stock Exchange.
Queclink is a leading M2M hardware provider based in Shanghai, specializing in the R&D and sales of embedded wireless M2M terminals.
The successful IPO marks a new start and milestone for Queclink. Queclink will invest more capital in improving products and services with the raised money, which will benefit customers of Queclink.